Integrated electromechanical arrangement and method of production

摘要

It is an object of the invention to provide a electromechanical structure comprising an input device and a printed wired board (3, 4), which structure is advantages in terms of manufacturing and offers freedom to the layout design of the printed wired board, the user interface as well as the appearance of the device itself. It is also an object of the invention to provide a electromechanical structure that is compact and facilitates the customizability and upgradability with a new electronic functionality without any need for modifications to the main electronics of the device. This is achieved by integrating the electromechanical assembly with the mechanical cover part of the electronic device by using an injection moulding process to compose an integrated combination (113) which is detachable from the electronic device. More precisely the objects of the invention are achieved by combining the injection mould technologies with the printing of electronic wired boards.