发明名称 Method for bonding reinforcing plate
摘要 A method for bonding a reinforcing plate to a flexible substrate, the method comprising the steps of: laminating a sheet-shaped thermosetting adhesive on a plate-like polyimide resin to prepare a reinforcing plate; drying the reinforcing plate so that its water content is decreased to the maximum allowable level or less; bonding the reinforcing plate to the flexible substrate through the adhesive by thermocompression bonding; and actually curing the adhesive by heating.
申请公布号 US2005000645(A1) 申请公布日期 2005.01.06
申请号 US20040871048 申请日期 2004.06.21
申请人 SHARP KABUSHIKI KAISHA 发明人 NAITOH KATSUYUKI
分类号 H05K1/02;H05K1/00;H05K3/00;H05K3/22;H05K3/38;(IPC1-7):B32B31/00 主分类号 H05K1/02
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