SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in connection reliability in a terminal.

SOLUTION: The semiconductor device manufacturing method comprises a step of forming terminals 12 protruding from the surface of first conductive foil 10 by etching the first conductive foil 10 except places serving as the terminals 12; a step of overlapping a resin sheet 14 on the first conductive foil 10 for the terminals 12 buried therein; a step of constructing a laminate sheet 18 by overlapping second conductive foil 16 on the resin sheet 14 with a resin layer 15 underlaid; a step of forming a conductive pattern 17 by etching the second conductive foil 16; a step of electrically connecting the conductive pattern 17 and the terminals 12; a step of electrically isolating the terminals 12 from one another; a step of electrically connecting a semiconductor element 22, and the conductive pattern 17 by firmly fixing the semiconductor element 22 to the sheet 18; and a step of forming a sealing resin 24 on the surface of the laminate sheet 18 for the semiconductor element 22 to be coated therewith.

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