| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein noise which flows inside from exterior through a solder plating stub can be defended while skewness of signal wave by noise from the solder plating stub and radiated noise generated from the solder plating stub itself can be shielded by mainly planning on design without applying cost, so that signal transmitting property is superior. <P>SOLUTION: The semiconductor device installs a semiconductor element 1 having a plurality of electrodes 2, a plurality of conductor wirings 5, 10, 11, etc. which are connected to the electrodes 2 of the semiconductor element 1, the solder plating stub 7 which accompanies the conductor wirings 5, 10, 11, etc., and wiring layers 51, 52 which are formed into a plurality of layers on a substrate. The solder plating stub 7 incidental with the first conductor wiring 5, and solder plating stubs 12, 13 incidental with singular or a plurality of the second conductor wirings 10, 11 adjoining to the first conductor wiring 5, exist in different conductor wiring layers 51, 52. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
