发明名称 PROCESS FOR MANUFACTURING WIRE WOUND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a wire wound electronic component having an improved inductance. SOLUTION: The process for manufacturing the wire wound electronic component 10 comprises a step for winding a coil conductor 2 around a core 1 composed of a ferrite material, a step for applying a resin composition containing magnetic powder and a solvent around the coil conductor 2, a step for drying the resin composition by electromagnetic induction heating, and a step for curing the resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005005606(A) 申请公布日期 2005.01.06
申请号 JP20030169779 申请日期 2003.06.13
申请人 TDK CORP 发明人 TANABE KOJI;TEZUKA SHINICHI
分类号 H01F41/02;(IPC1-7):H01F41/02 主分类号 H01F41/02
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