| 摘要 |
PROBLEM TO BE SOLVED: To provide electroless plating equipment and electroless plating method capable of more surely performing removal of air bubbles from the inside of a plating liquid. SOLUTION: At the time of performing the treatment of a substrate by opposing a plate and the substrate and discharging a treating liquid from a treating liquid discharging section of the plate, the air bubbles in the treating liquid are discharged from the aperture formed at the plate, by which the nonuniformity of the treatment due to the air bubbles can be reduced. The removal of the air bubbles from the inside of the treating liquid can be more promoted by forming an inclination toward the aperture. COPYRIGHT: (C)2005,JPO&NCIPI
|
