| 发明名称 |
Three-dimensional stacked substrate arrangements |
| 摘要 |
Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
|
| 申请公布号 |
US2005003650(A1) |
申请公布日期 |
2005.01.06 |
| 申请号 |
US20030610743 |
申请日期 |
2003.07.02 |
| 申请人 |
RAMANATHAN SHRIRAM;MORROW PATRICK;LIST SCOTT;CHAN MICHAEL Y.;KOBRINSKY MAURO J.;KIM SARAH E.;O'BRIEN KEVIN P.;HARMES MICHAEL C.;MARIEB THOMAS |
发明人 |
RAMANATHAN SHRIRAM;MORROW PATRICK;LIST SCOTT;CHAN MICHAEL Y.;KOBRINSKY MAURO J.;KIM SARAH E.;O'BRIEN KEVIN P.;HARMES MICHAEL C.;MARIEB THOMAS |
| 分类号 |
H01L21/60;H01L21/98;H01L25/065;(IPC1-7):H01L21/44;H01L23/02;H01L21/48;H01L23/52;H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
