| 摘要 |
[PROBLEMS] To provide a communication module that is small but is superior in high-frequency characteristics and capable of high-speed communication. [MEANS FOR SOLVING PROBLEMS] The communication module comprises an LD (semiconductor member) (10), a flexible printed circuit board (FPC) (11) on which an LD (10) is installed and which is electrically connected, a stem through which the FPC (11) is inserted and which is secured thereby, and a cap (13) so arranged as to cover the LD (10). Power supply through the FPC (11) to the LD (10) and take-out of a signal from the LD (10) are achieved without using a lead pin, and high-frequency characteristics are improved. A package structure composed of the stem (12) and the cap (13) makes the module compact. |
