发明名称 Semiconductor package having multiple embedded chips
摘要 A semiconductor package includes multiple embedded chips, each chip including a common circuit having substantially the same common function. The common circuit in a selected one of the chips is enabled. The common circuit in one or more other ones of the chips is disabled. As a result, the enabled common circuit performs the common function for the selected chip and the one or more other chips.
申请公布号 US2005001300(A1) 申请公布日期 2005.01.06
申请号 US20040803043 申请日期 2004.03.18
申请人 LEE HO-CHEOL 发明人 LEE HO-CHEOL
分类号 H01L25/065;(IPC1-7):H01L21/48;H01L23/52 主分类号 H01L25/065
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