METHOD FOR AUTOMATICALLY SORTING DEFECT OF SEMICONDUCTOR WAFER TO STABILIZE PROCESS AND IMPROVE YIELD WITHIN SHORTER INTERVAL OF TIME

摘要

PURPOSE: A method for automatically sorting a defect of a semiconductor wafer is provided to stabilize a process and improve yield by automatically sorting an under defect and a surface defect in detecting a defect of a wafer having a pattern. CONSTITUTION: An automatical defect sorting process is performed by using a brightness difference value of a difference image of an under defect(35) and a surface defect from -225 to 225. The under defect is detected by using a brightness difference value from -225 to 0. The surface defect is detected by using a brightness difference value from 0 to 225.