DESICCANT MATRIX COMPOSITION FOR APPLICATION AT RAUM TEMPERATURE
摘要
<p>A desiccating matrix composition that includes hydrogen-bonding polymer, plasticizer, organic-modified clay, adsorbent and optionally metal stearate. The hydrogen-bonding polymer is moisture cured at 100m temperature.</p>
申请公布号
WO2005000462(A1)
申请公布日期
2005.01.06
申请号
WO2004US16441
申请日期
2004.05.25
申请人
H.B. FULLER LICENSING & FINANCING, INC.;HOGLUND, HEIDI, J.;NGUYEN-MISRA, MAI, T.
