发明名称 REFLOW DEVICE
摘要 <p>A reflow device capable of reducing in a short time the temperature in a reflow heating portion of a furnace body and preventing adhesion of a flux gas in the reflow heating portion. A circulation system (26) is provided outside a furnace body (11) for heating by reflow a work piece (W) in a reflow heating portion (13), where the circulation system (26) takes out a high-temperature atmosphere to the outside and then returning it to the furnace body (11). Cooling means (28) for cooling the high-temperature atmosphere is provided in the circulation system (26). The cooling means (28) has a cooling condenser (31) for liquefying vaporized-state flux by fed cooling water. A flow rate of the cooling water fed to the cooling condenser (31) is regulated by an electrically operated valve (36) operated according to an electric signal. The temperature of circulation air after it passed the cooling condenser (31) is detected by a temperature sensor (41). A temperature indicator/adjuster (42) that received the detected circulation air temperature from the temperature sensor (41) adjusts a flow rate of the cooling water flowing through the electrically operated valve (36) so that the detected temperature is adjusted to a temperature set by the temperature indicator/adjuster (42).</p>
申请公布号 WO2005000513(A1) 申请公布日期 2005.01.06
申请号 WO2004JP08876 申请日期 2004.06.24
申请人 KABUSHIKI KAISHA TAMURA SEISAKUSHO;KABUSHIKI KAISHA TAMURA FA SYSTEM;YAMASHITA, FUMIHIRO;DOZONO, KIYOSHI 发明人 YAMASHITA, FUMIHIRO;DOZONO, KIYOSHI
分类号 B23K1/008;B23K31/02;F27D17/00;F27D19/00;H05K3/34;(IPC1-7):B23K1/008 主分类号 B23K1/008
代理机构 代理人
主权项
地址