| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can suppress an increase in manufacturing period and cost thanks to its simplified circuit structure and wherein a burn-in test can be conducted in a wafer status. SOLUTION: A dicing line 2 is provided with a Vcc line 12 that conveys a power potential Vcc to a plurality of microcomputer chips 1 at the same time and a single CNT line 13 to convey a power supply control signal CNT. In each microcomputer chip 1, a P-channel transistor 24 is connected on a Vcc lead-in wire 112 in a power supply circuit 63 for supplying an internal Vcc. A composite gate 25 outputs an OR with an output signal indicating OK/NG from the power supply control signal CNT and an OK indication register 42 when a BI signal showing Vcc application to the Vcc line 12 is inputted. In case of a non-defective chip, the P-channel transistor 24 is turned on according to the output signal and the internal Vcc is supplied, and, in case of a defective chip, the P-channel transistor 24 is turned off and the supply of the internal Vcc is stopped. COPYRIGHT: (C)2005,JPO&NCIPI
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