PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a high-density printed wiring board which is improved in productivity by simplifying processes and excellent in adhesibility and on which a resistor can be disposed so that the metallic layers (conductor patterns) of electrodes etc., may not be disconnected by steps. SOLUTION: The printed wiring board is provided with a contact layer/resistor constituting section. The contact layer/resistor constituting section has a resistance function section formed to connect the ends of metallic layers of at least two separately formed conductor patterns and an adhesive property improving function section laid under the metallic layers of the at least two conductor patterns. The resistance function section and adhesive property improving function section are constituted of a contact/resistance layer composed of an integrally formed thin film which acts to exhibit the resistance function while the adhesive properties between the metallic layers and insulating layers are improved. COPYRIGHT: (C)2005,JPO&NCIPI