发明名称 |
Method and apparatus for electrochemical mechanical processing |
摘要 |
Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
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申请公布号 |
US2005000801(A1) |
申请公布日期 |
2005.01.06 |
申请号 |
US20040880752 |
申请日期 |
2004.06.30 |
申请人 |
WANG YAN;NEO SIEW;LIU FENG;TSAI STAN D.;HU YONGQI;DUBOUST ALAIN;MANENS ANTOINE;WADENSWEILER RALPH M.;MAVLIEV RASHID;CHEN LIANG-YUH;OLGADO DONALD J.K.;BUTTERFIELD PAUL D.;TSENG MING-KUEI;CHANG SHOU-SUNG;SUN LIZHONG |
发明人 |
WANG YAN;NEO SIEW;LIU FENG;TSAI STAN D.;HU YONGQI;DUBOUST ALAIN;MANENS ANTOINE;WADENSWEILER RALPH M.;MAVLIEV RASHID;CHEN LIANG-YUH;OLGADO DONALD J.K.;BUTTERFIELD PAUL D.;TSENG MING-KUEI;CHANG SHOU-SUNG;SUN LIZHONG |
分类号 |
B23H5/06;B23H5/08;B23H5/10;B24B37/04;B24B49/16;B24B53/007;B24D13/14;H01L21/321;(IPC1-7):C25D17/00 |
主分类号 |
B23H5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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