Processing apparatus, method for fabrication of semiconductor device by using the processing apparatus, and semiconductor device fabricated by this method

摘要

The processing apparatus in accordance with the present invention comprises an object holding unit for holding a processing object, a tool holding unit for holding a tool for processing the processing object, and a relative movement mechanism for causing relative movement of the processing object held in the object holding unit and the tool held in the tool holding unit, while maintaining contact therebetween. The object holding unit and/or the tool holding unit are composed of a plurality of support plates of almost flat shape having elastic property which are arranged in a row.