| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip size package in which the position of the pad electrode of an LSI and the solder ball can be altered arbitrarily and the degree of freedom can be enhanced in connection. <P>SOLUTION: The chip size package comprises a semiconductor chip having first and second electrodes formed on the surface, a resin for sealing the surface, first solder balls 601 and 603 provided on the first electrode and connected electrically therewith, and second solder balls 602, 604 and 605 provided at positions apart from the second electrode and connected electrically therewith. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
