| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method, a polishing method and a micro waviness reducing method for a substrate which reduce micro waviness of a polished object after polished in finish-polishing a memory hard disk or polishing a semiconductor device. <P>SOLUTION: The substrate manufacturing method uses a polishing fluid composition containing abrasives and water, and a polishing pad having a surface member with an average pore diameter of 0.01-35μm. The substrate polishing method uses the polishing fluid composition containing the abrasives and water, and the polishing pad having the surface member with the average pore diameter of 0.01-35μm. The substrate micro waviness reducing method uses: the polishing fluid composition containing the abrasives and water; and the polishing pad having the surface member with the average pore diameter of 0.01-35μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
