发明名称 SPACER FOR CIRCUIT MATERIAL AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a spacer for a circuit material developing antistatic properties at a high level regardless of a change in humidity and also excellent in solvent resistance or shaving resistance. SOLUTION: The spacer for the circuit material is constituted by providing a laminating film based on a composition (A) and a crosslinking agent (B) on at least one side of a thermoplastic resin film. The composition (A) comprises polythiophene and a polyanion and/or a polythiophene derivative and the polyanion, and the laminating film has a sea-island structure comprising the composition (A) and the crosslinking agent (B). The spacer for the circuit material is manufactured by coating at least one side of the thermoplastic resin film with a coating solution containing the composition (A) and the crosslinking agent (B), drying the coated thermoplastic resin film to stretch the same and heat-treating the stretched thermoplastic resin film. The composition (A) comprises polythiophene and the polyanion and/or the polythiophene derivative and the polyanion. The content of the crosslinking agent (B) in the coating solution is 10-85 wt.%. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005001113(A) 申请公布日期 2005.01.06
申请号 JP20030163507 申请日期 2003.06.09
申请人 TORAY IND INC 发明人 TAKADA HAGUMU;KUBOTA ARIMICHI;MIMURA TAKASHI
分类号 B32B27/00;(IPC1-7):B32B27/00 主分类号 B32B27/00
代理机构 代理人
主权项
地址