发明名称 |
Production method for semiconductor device |
摘要 |
The invention aims at providing a dielectric film having a low dielectric constant and enhanced mechanical strength. A surfactant and an silica derivative are dissolved into a solvent at a desired mole ratio. The precursor solution is applied over the substrate, and the substrate is exposed to a silica derivative atmosphere before being sintered, thereby supplying a silica derivative. Thus, contraction of the film stemming from hydrolysis is inhibited, and a sturdy mesoporous silica thin film which takes the self-assembly of the surfactant as a mold is obtained while cavities are maintained intact without being fractured. Thus, there is formed an inorganic dielectric film which is formed on the surface of the substrate and has a cyclic porous structure including layered or columnar pores oriented so as to become parallel with the surface of the substrate. |
申请公布号 |
US2005003678(A1) |
申请公布日期 |
2005.01.06 |
申请号 |
US20040490767 |
申请日期 |
2004.03.25 |
申请人 |
NISHIYAMA NORIKAZU;UEYAMA KOREKAZU;OKU YOSHIAKI |
发明人 |
NISHIYAMA NORIKAZU;UEYAMA KOREKAZU;OKU YOSHIAKI |
分类号 |
H01L21/316;H01L21/768;H01L21/8246;H01L23/31;H01L23/498;H01L23/522;H01L23/532;H01L27/115;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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