WAFER CLEANING APPARATUS WITH ENHANCED STRUCTURE FOR REMOVING UNIFORMLY PARTICLES FROM EDGE AS WELL AS SURFACES OF WAFER

摘要

PURPOSE: A wafer cleaning apparatus is provided to remove uniformly particles from an edge as well as surfaces of a wafer by using an edge cleaning clamp and a brush. CONSTITUTION: A wafer cleaning apparatus includes a plurality of rotary clamps, a cleaning clamp and a brushing part. The plurality of rotary clamps(350) are arranged along an edge of a wafer(W). Each rotary clamp includes a circular groove for holding the wafer edge. The rotary clamp is capable of rotating the wafer by spinning the rotary clamp itself. The cleaning clamp(200) has the same structure as that of the rotary clamp. The cleaning clamp is used for cleaning the wafer edge. The brushing part(300) is used for cleaning a front and rear surface of the wafer.