| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing laminate which is used for a polishing pad suitable for surface flattening work of a semiconductor device wafer such as an interlayer insulation film or metallic wiring, allows optical detection of a terminal point of polishing, and realizes high accuracy polishing by solving problems of in-plane dispersion and aging fluctuation of the polishing pad with an aperture complying with an optical detecting method of conventional structure. <P>SOLUTION: This polishing laminate comprises at least a polishing layer and a support layer, and has grooves used as passages for polishing slurry; and the grooves have light transmitting properties. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
