| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an alignment device which enables alignment of a mask and a wafer quickly and with high precision, and to provide alignment equipment which can set clearance between the mask and the wafer with higher precision with simple configuration. <P>SOLUTION: The alignment device comprises mask (50) having a mask mark (M1), a work (40) of an object to be treated which has an alignment mark (W1), a drive system which sets mutual relative position relation while making the mask and the work counter through clearance, and a detector (203) for detecting the mask mark and the alignment mark exposed in the aperture of the mask mark from an oblique direction by using an image formation optical system. A focal coincidence position of an image formation optical system on the work is obtained, based on a detected mask mark and a virtual of the mask mark projected on a work in the aperture. A detection region (Z) in the aperture of a mask mark from which the alignment mark of the work is to be read based on the data of the focal coincidence is set. The drive system is controlled (205) based on difference between the alignment mark of a work detected in the detection region and an alignment reference position (ms) of the mask mark. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
