| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and a multilayer wiring board capable of forming a highly reliable contact via, and to provide its producing process. SOLUTION: The wiring board comprises a wiring layer 12 formed on the surface of a substrate 11, a first resin insulation film 13 having an opening 13a leading to the wiring layer, a metal plating conductive layer 15 formed on the wiring layer 12 in the opening 13a, and a second resin insulation film 16 formed on the surface of an assembly from the substrate 11 to the conductive layer 15 and having an opening 16a formed by irradiating the second resin insulation film 16 with a laser beam to expose the conductive layer 15. The conductive layer 15 is thick enough to stop the laser beam when the second resin insulation film 16 is irradiated with the laser beam. COPYRIGHT: (C)2005,JPO&NCIPI |
