| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment method for enhancing the adhesiveness of the surface of an insulating layer of a base member composed of a conductor layer and the insulating layer to an adhesive layer with high etching accuracy without damaging the conductor layer in a manufacturing process of a multilayer wiring board, and to provide the multilayer wiring board with high quality. SOLUTION: The multilayer wiring board has a structure wherein base members each comprising the organic insulating layer and the conductor wire layer are stacked via the adhesive layer. The surface of the organic insulating layer on one side of the base member composed of the conductor wire layer and the organic insulating layer is roughened with an arithmetic average height Ra value of 0.1 to 1,000 nm, and thereafter the adhesive layer and the organic insulating layer subjected to roughening are adhered to each other for the stacking. COPYRIGHT: (C)2005,JPO&NCIPI |
