| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive silicone resin composition which uses economical silicone resin having high workability, has excellent storage stability, is alkali soluble before photosetting and changed into alkali insoluble after photosetting, can be patterned into a negative-type pattern by photolithography without using a photoacid generating agent in the photosetting process, and can produce a hardened product having high sensitivity, high resolution, excellent heat resistance, moisture resistance, chemical resistance and mechanical strength, and to provide its hardened product and a method for forming a negative-type fine pattern by photolithography by using the above composition. <P>SOLUTION: The photosensitive silicone resin composition contains alkali-soluble silicone resin which has 500 to 50,000 average molecular weight and a photo initiator. The alkali-soluble silicone resin is obtained by co-hydrolysis condensation of epoxy-modified organoxysilane and (meth)acryl-modified organoxysilane or these compounds and organoxysilane, in the proportions of ≥10 mol% of groups having a hydrolyzable epoxide with respect to the entire organic groups except for alkoxy groups coupled with a silicon atom, ≥5 mol% of groups having a (meth)acrylic functional group, and ≥40 mol% of mono-organotriorganoxysilane and tetraorganoxysilane with respect to the amount of all the silanes. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
