| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip-like electronic component which can be manufactured readily and highly reliably at a low cost and can realize higher function as a single component, its manufacturing method and its packaging structure. <P>SOLUTION: The manufacturing method of the chip-like electronic component has a process for fixing on a base 1 a plurality or a plurality of kinds of semiconductor chips 4, a process for forming an insulating material layer 5 by applying an insulating substance, a process for peeling a pseudo wafer 6 whereto the semiconductor chip is fixed from the base, a process for forming wiring connected to an electrode of the semiconductor chip in one surface side of the pseudo wafer 6, a process for providing at least the insulating material layer with a through hole passing through the thickness direction of the pseudo wafer, a process for forming a conductive layer connected to the wiring in the through hole and a process for discrete dicing to the chip-like electronic component holding the conductive layer in the thickness direction by cutting between semiconductor chips. Thereby, the chip-like electronic component and also its packaging structure can be obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
