| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin and inexpensive semiconductor device exhibiting improved optical performance by eliminating the need for a cover glass being placed on a package. SOLUTION: The semiconductor device comprises a package 1 having a recess 3 in the upper surface, an internal terminal group 4 arranged at the circumferential edge part on the bottom face of the recess, an external terminal group 5 arranged on the outer circumferential surface of the sidewall 2 of the package surrounding the recess and connected with the internal terminal 4 while penetrating the sidewall, a semiconductor element 6 bonded to the bottom face of the recess and having an imaging function, and a conductor member 9 group for connecting an electrode group arranged at the circumferential edge part on the major surface 6a of the semiconductor element with the internal terminal group. An optical member 12 covering the effective pixel region of the semiconductor element directly is sealed on the major surface thereof. COPYRIGHT: (C)2005,JPO&NCIPI |
