| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling mechanism for a semiconductor device which can easily and surely prevent flowing into the screw hole of a pasted thermoconductive material at the time of fixing a cooling mechanism with a screw to a semiconductor device as a heat generating body in order to cool the same. SOLUTION: Screw holes 16a to 16d are formed to the four corners of a fitting surface 14 of a base 12 forming the cooling mechanism 10 for semiconductor device. The screw holes 16a to 16d allow screwing of the screw 60 for fixing the cooling mechanism 10 for semiconductor device to the semiconductor device 40. In the periphery of the screw holes 16a to 16d, grooves 18a to 18d are formed to have the surface of almost L-shape and to have the cross-section of almost U-shape, and are respectively formed to prevent flowing into the screw holes 16a to 16d of an extra heat conducting material 52 when the cooling mechanism 10 for semiconductor device is joined with the semiconductor device 40. COPYRIGHT: (C)2005,JPO&NCIPI |
