发明名称 WIRE MATERIAL PAYOUT DEVICE AND WIRE SOLDER
摘要 <p>A wire material payout device where a soft wire material is easily inserted and set. The wire material payout device pays out a wire material by a chuck body (7) capable of gripping and releasing the material and moving it in the forward and backward directions. Releasing means for maintaining a released state of the chuck body is disposed in the device.</p>
申请公布号 WO2005000515(A1) 申请公布日期 2005.01.06
申请号 WO2004JP08877 申请日期 2004.06.24
申请人 PENTEL KABUSHIKI KAISHA;SENJU METAL INDUSTRY CO., LTD.;ISHII, KOU;YANAGAWA, YOSHIAKI;MARUYAMA, SHIGEKI 发明人 ISHII, KOU;YANAGAWA, YOSHIAKI;MARUYAMA, SHIGEKI
分类号 B23K3/06;(IPC1-7):B23K3/06 主分类号 B23K3/06
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