CERAMIC PACKAGE USING INEXPENSIVE NICKEL-PLATED KOVAR LEAD

摘要

PURPOSE: A ceramic package is provided to reduce fabricating cost by performing a seam sealing process using an inexpensive nickel-plated Kovar lead as compared with a conventional thermal fusion method using expensive AuSn. CONSTITUTION: A chip(300) functions as a filter. The chip is protected from outer surroundings by a nickel-containing lead(330). A ceramic layer part(310) includes a wall(316) electrically connected to the lead. The chip is connected to the ceramic layer by a connection unit. The wall is a conductor made of a Koval material.