| 摘要 |
PROBLEM TO BE SOLVED: To form an alignment mark (identification mark) required for location alignment necessary for the manufacturing process of an wiring circuit board, without increasing the number of processes; further, make misregistration between the identity mark and a projection be smaller in the interconnect circuit substrate in which the projection for connection between upper/lower conductors, consisting of many metals, is arranged on the surface of metallization layer; layer-to-layer insulating layer is formed on front surface formed by the projection for the connection between upper/lower conductors of the metallization layer, in such a state that it is penetrated by the projection for connection between upper/lower conductors, and metallization layers consisting of the metallization layer are formed on front surface including the projection for connection between upper/lower conductors of the layer-to-layer insulating layer, or its manufacturing method. SOLUTION: The board has an identification mark 63, formed by the same material and to the same height as those of the projections for connection between upper/lower conductors 53, 57, and the projections for connection between upper/lower conductors 53, 57 and the identification mark 63 are formed in the same process. COPYRIGHT: (C)2005,JPO&NCIPI
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