发明名称 SEMICONDUCTOR WAFER HEATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor wafer heating apparatus which can be used in a temperature range higher than about 1,200°C, have a good thermal efficiency, rapidly increase or decrease the temperature, increase the processing efficiency of a single semiconductor wafer, eliminate the possibility of becoming a contamination source to the semiconductor wafer, have an excellent uniform in-plane temperature for the semiconductor wafer, and have a good film formation property and an excellent durability. SOLUTION: A microwave transmitting window 12 is provided in a bottom 11a of a chamber 11, a susceptor 17 made of a ceramic containing at least one selected from the group consisting of B, Al, Si, Ge, As, Sb, and Te for carrying a semiconductor wafer W on its upper surface 17a is provided in the chamber 11, and a microwave generator 21 for applying microwave to the susceptor 17 via the microwave transmitting window 12 is provided outside the window 12. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005005617(A) 申请公布日期 2005.01.06
申请号 JP20030169978 申请日期 2003.06.13
申请人 SUMITOMO OSAKA CEMENT CO LTD 发明人 NAGATA TAKESHI;MURAKAMI YOSHIHIKO
分类号 H05B6/64;C23C16/46;H01L21/205;H01L21/302;H01L21/3065;H05B6/80;(IPC1-7):H01L21/205 主分类号 H05B6/64
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