CHIP TYPE CAPACITOR AND ITS MANUFACTURING METHOD, AND LEAD FRAME USED FOR CAPACITOR

摘要

PROBLEM TO BE SOLVED: To provide a chip type capacitor capable of forming a fillet essential for a stabilization of a packaging posture of a product without adding an extra manufacturing process. SOLUTION: A chip type capacitor is manufactured by the steps of exposing a capacitor element 2 and a bottom part to a packaging face 9 side of an exterior resin 1, welding an end of an anode terminal 5 as crossing to an anode lead wire 3 coming out from the capacitor element 2, connecting and fixing a cathode terminal 6 to a cathode layer of the capacitor element 2 through a conductive adhesive agent 4 so that a bottom side is exposed, and covering the whole capacitor element 2 with a resin by a transfer molding. A lead frame provided by windows plated beforehand is used for the cathode and anode terminals 5, 6, and the plated faces are introduced out on a part of the anode terminal 5 and the cathode terminal 6 led out from the side of the product in the chip type capacitor with its outside dimension cut to the desired dimension by a dicing processing or the like. COPYRIGHT: (C)2005,JPO&NCIPI