| 发明名称 |
CMP slurry and method of manufacturing semiconductor device |
| 摘要 |
CMP slurry contains a polishing component to polish a region to be polished, which includes at least one of a sub-region made of insulative material and a sub-region made of conductive material, and a restoring component to restore a scratch caused on the region to be polished. The scratch can thus be restored during the polishing. |
| 申请公布号 |
US2005003666(A1) |
申请公布日期 |
2005.01.06 |
| 申请号 |
US20040902940 |
申请日期 |
2004.08.02 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KURASHIMA NOBUYUKI;MINAMIHABA GAKU;YANO HIROYUKI |
| 分类号 |
B24B57/02;B24B37/00;C09G1/02;H01L21/304;H01L21/3105;H01L21/321;H01L21/768;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B24B57/02 |
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