| 摘要 |
PURPOSE: A method for mounting a solder ball is provided to avoid a time loss and accelerate efficiency by detecting a mistaken ball mounting while other operations are carried out. CONSTITUTION: Flux is supplied form at least one flux transcription head(5,6) with a flux transcription pin(17,18) to a predetermined position of a substrate(2). Solder balls are mounted on the predetermined position by at least one solder ball mounting head(3,4) with an absorption nozzle(15,16). The solder ball mounting head and the flux transcription head are alternatively disposed in a head support unit. The solder ball is absorbed by the absorption nozzle. The flux is placed on a free end part of the flux transcription pin. The flux is transcribed to the substrate by the flux transcription pin. Solder balls are mounted on the predetermined position by the ball mounting head. The solder ball mounting method is performed when the rotation of the head support unit stops.
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