| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing diamond electronic element which can facilitate division into such elements and reduce a manufacturing cost. SOLUTION: Grooves 2 as boundaries elements are formed in a substrate 1 by a dicer. A spin-on glass solution is filled into the grooves 2 from an injector and then sintered, thus filling silicon oxide in the grooves 2. Thereafter, an updoped diamond layer 4 and a boron-doped diamond layer 5 are formed by a CVD (chemical vapor deposition) method, and an electrode 6 is formed on the boron-doped diamond layer 5. Next the structure is wet etched using hydrofluoric acid to remove silicon oxide, and then a substrate 1 is diced along the grooves 2 as scribe lines, whereby the substrate is divided into individual diamond electronic elements 7. COPYRIGHT: (C)2005,JPO&NCIPI
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