| 摘要 |
PROBLEM TO BE SOLVED: To provide the wiring layout structure of a printed circuit wiring board for improving the degree of freedom of a wiring layout at the time of forming wiring from a component package having a bottom face electrode to a printed circuit wiring board. SOLUTION: In this printed circuit wiring board 100 mounted with a component packet having a bottom face electrode, the shortest distance between pads for electrode connection is made different depending on places. An interval where three wirings can be put through is arranged between the pads of an outermost first column, an interval where two wiring can be put through is arranged between the pads of a second column, an interval where one wiring can be put through is arranged between the pads of a third column and an interval between the pads of a fourth column is made narrower than the interval between the pads of the third column. COPYRIGHT: (C)2005,JPO&NCIPI
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