| 摘要 |
PROBLEM TO BE SOLVED: To form a high-layer resist, and to obtain a circuit in which the ratio of a circuit width to a circuit height reaches 1:2 or more, in a printed wiring board on which the circuit is formed by selectively precipitating copper on the surface of a base material by an additive method. SOLUTION: In a printed circuit board, the high-layer resist is formed to the base material by a resist patterning process, in which a circuit pattern is exposed and developed to a resist laminated on the base material and a circuit non-forming section is coated with a crosslinking resist; and a resist laminating process, in which the same circuit pattern as the resist patterning process is exposed and developed to the resist laminated again, and the crosslinking resist is laminated on the circuit non-forming section. In the printed circuit board, the circuit having the large circuit height with the ratio of the circuit width to the circuit height as set in 1:2 or more is formed, by precipitating and laminating a conductor to the non-forming section of the high-layer resist by an electrolysis or an electroless plating. Such a printed circuit board is manufactured. COPYRIGHT: (C)2005,JPO&NCIPI
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