| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for reducing a wiring width in the formation of a copper wiring by the semi-additive method of a printed circuit board, etc., suppressing an undercut and further forming a uniform wiring width in a plane. SOLUTION: The method for manufacturing the printed circuit board having the fine wiring of a line/space of 50μm/50μm or less using the semi-additive method includes a step of processing with an etchant liquid in which an etching speed of non-electrolytic copper plating of a seed layer is twice as fast as the etching speed of the electrolytic copper plating, and non-electrolytic copper plating removing time in space of the fine wiring having the line/space of 50μm/50μm or less is larger than 50μm or less is three times as fast as the non-electrolytic copper plating removing time in the space larger than 50μm, and manufacturing of the printed circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
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