发明名称 FLUOROPLASTIC COPPER-CLAD LAMINATE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a fluoroplastic copper-clad laminate which causes little transmission loss and is excellent in stability and lengthy, and a manufacturing method thereof. SOLUTION: This fluoroplastic copper-clad laminate 11 for a high-frequency microstrip line has a dielectric layer 12 which is constituted of at least either a composite sheet of a fluoroplastic and a glass fiber woven fabric or a fluoroplastic sheet and a metal layer 13 which is formed at least on one or both sides of the dielectric layer 12 or inside it. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005001274(A) 申请公布日期 2005.01.06
申请号 JP20030168020 申请日期 2003.06.12
申请人 CHUKO KASEI KOGYO KK 发明人 TOMINAGA HIROSHI;IMAZATO HIDEO;SAKAI KAZUHIRO;KAWAMOTO KEIJI;MAEYAMA TAKAOKI;KAMOGAWA KOJI;MIMATA TAKASHI
分类号 B32B15/08;(IPC1-7):B32B15/08 主分类号 B32B15/08
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