发明名称 |
FLUOROPLASTIC COPPER-CLAD LAMINATE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a fluoroplastic copper-clad laminate which causes little transmission loss and is excellent in stability and lengthy, and a manufacturing method thereof. SOLUTION: This fluoroplastic copper-clad laminate 11 for a high-frequency microstrip line has a dielectric layer 12 which is constituted of at least either a composite sheet of a fluoroplastic and a glass fiber woven fabric or a fluoroplastic sheet and a metal layer 13 which is formed at least on one or both sides of the dielectric layer 12 or inside it. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005001274(A) |
申请公布日期 |
2005.01.06 |
申请号 |
JP20030168020 |
申请日期 |
2003.06.12 |
申请人 |
CHUKO KASEI KOGYO KK |
发明人 |
TOMINAGA HIROSHI;IMAZATO HIDEO;SAKAI KAZUHIRO;KAWAMOTO KEIJI;MAEYAMA TAKAOKI;KAMOGAWA KOJI;MIMATA TAKASHI |
分类号 |
B32B15/08;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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