| 摘要 |
The invention concerns an apparatus for inspection of a wafer, encompassing at least two incident-light illumination devices that radiate a respective illuminating light beam which is incident obliquely onto the surface of a wafer to be inspected and respectively defines an illumination axis, an image capture device for capturing an image of the surface in a dark-field arrangement, and a wafer receiving device for receiving the wafer, on whose surface linearly extending features are configured, in a definable orientation. The apparatus is characterized in that the illumination axes are oriented perpendicular to one another, and the apparatus is designed in such a way that a projection of the respective illumination axis onto the surface of the wafer is oriented substantially perpendicular to respective linear features on the surface of the wafer. With the apparatus, macrodefects can be detected and the quality of the edge profile of features configured on the surface of the wafer can be assessed.
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