| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a contactless IC card whose card surface is made smooth while protecting an IC chip. <P>SOLUTION: While a metallic reinforcing plate 5 for protecting the IC chip 3 is mounted on the top surface of the IC chip 3 mounted on an insulating inlet sheet 1 across sealing resin 4 sealing the IC chip 3, the inlet sheet 1 provided with a heat-resisting resin layer 6 mitigating heat conduction of the reinforcing plate 5 is laminated on the top surface of the reinforcing plate 5 while held between resin sheets 7 and 8 which become the main body substrate of the IC card. Consequently, the resin layer 6 functions as a heat insulating material to reduce conduction of heat generated by the metallic reinforcing plate 5 during cooling after heat press processing, and then a resin sheet part nearby the metallic reinforcing plate 5 is prevented from being cooled earlier than other resin sheet parts to uniformly cool the resin sheet, thereby making the card surface smooth. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
