| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of mounting a chip component by which a micro chip component can be mounted with reliability on micro lands and a mount substrate can be reduced in size while at the same time being increased in packaging density, and also to provide the mount substrate. <P>SOLUTION: The method of mounting a chip component includes processes of forming conductive bumps 2 at electrodes 4 of the chip component 1, forming an insulating adhesive layer 8 at least on part of a wiring board 24 which faces a main body 1a of the chip component 1, mounting the main body 1a on the insulating adhesive layer 8 after positioning the electrodes 4 on the lands 6, bonding the conductive bumps 2 to the lands 6 by heating the conductive bumps 2 and the insulating adhesive layer 8, and then hardening the conductive adhesive layer 8. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
