发明名称 FLEXIBLE PRINTED CIRCUIT BOARD, FLEXIBLE PRINTED CIRCUIT BOARD MODULE, AND METHOD OF PRODUCING FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of producing a flexible printed circuit board which produces the board speedily and inexpensively. SOLUTION: On the surface of a base material film 10 in the state of a tape or a sheet, a conductor layer 11 is provided in advance. First, sprocket holes 12 are bored at the base material film and the conductor layer. Next, a wiring pattern is formed on the conductor layer. Next, at a necessary place of the conductor layer on which the wiring pattern is formed, a solder resist layer 15 is formed. Next, on the backside of the base material film, resin is stuck to an electronic part fitting area 10a by using a screen printing method and a dispensing method, and the resin is cured to make a reinforcing part 16 for reinforcing the base material film. Next, at the necessary place of the conductor layer on which the wiring pattern is formed, surface work such as plating is performed to obtain the flexible printed circuit board such as a TAB tape carrier. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005005585(A) 申请公布日期 2005.01.06
申请号 JP20030169415 申请日期 2003.06.13
申请人 SHINDO DENSHI KOGYO KK 发明人 NAKAJIMA EIICHI;KOBAYASHI KATSUYOSHI
分类号 H05K1/02;H01L21/60;(IPC1-7):H05K1/02 主分类号 H05K1/02
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