发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To realize simultaneously shallow junction and activation of a diffusion layer in a transistor for LOP use etc. in which a gate length is short and the shallow junction is necessary. SOLUTION: In the method for manufacturing a semiconductor device, first a gate insulating film and a gate electrode are formed on a substrate, second the gate electrode is used as a mask and Ge ion or Si ion is implanted in order to make the substrate surface amorphous, and after that, the gate electrode is used as a mask, and impurities of B ions or the like for forming a diffusion layer are implanted in a part where the substrate is made amorphous. Further, the diffusion layer is irradiated with the visible light for a short time. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005005406(A) 申请公布日期 2005.01.06
申请号 JP20030165719 申请日期 2003.06.10
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC 发明人 OTSUKA FUMIO
分类号 H01L27/092;H01L21/22;H01L21/265;H01L21/268;H01L21/28;H01L21/324;H01L21/336;H01L21/8234;H01L21/8238;H01L27/088;H01L29/10;H01L29/78;(IPC1-7):H01L29/78;H01L21/823 主分类号 H01L27/092
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