发明名称 Apparatus, method, and computer program for wafer inspection
摘要 The invention concerns an apparatus for inspection of a wafer, encompassing at least one illumination device in order to radiate an illuminating light beam onto a surface of the wafer, and an image capture device in order to capture an image of an illuminated region on the surface of the wafer in a plurality of spectral regions, a color modification device being provided in order to modify the color spectrum of the illuminating light beam or of the reflected light beam. The wafer inspection apparatus is characterized in that the color modification device is designed in such a way that the color spectrum of the illuminating light beam, or that of the image that is acquired of the surface of the wafer, is adaptable to the spectral sensitivity of the image capture device.
申请公布号 US2005002021(A1) 申请公布日期 2005.01.06
申请号 US20040880122 申请日期 2004.06.30
申请人 LEICA MICROSYSTEMS SEMICONDUCTOR GMBH 发明人 KREH ALBERT;BACKHAUSS HENNING
分类号 G01J3/50;G01M11/00;G01N21/88;G01N21/95;H01L21/66;(IPC1-7):G01N21/88 主分类号 G01J3/50
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