发明名称 |
ELECTRONIC COMPONENT MODULE AND METHOD FOR THE PRODUCTION THEREOF |
摘要 |
The invention relates to a connection-substrate for at least one electronic component. Said substrate comprises a flat substrate body in whose flat surface internal contact projections (3) are recessed by partial removal or deformation (2, 8), for the flip-chip contacting rod of a component or, optionally, external contact projections (9) for connection to a printed circuit board. The production of said contact-projections in a hot stamping method or by means of laser removal enables very small projections to be produced in a narrower grid than current chip-connections. |
申请公布号 |
WO03100854(A3) |
申请公布日期 |
2005.01.06 |
申请号 |
WO2003DE01612 |
申请日期 |
2003.05.19 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;HEERMAN, MARCEL;VAN PUYMBROECK, JOZEF;BEYNE, ERIC;VANDEVELDE, BART |
发明人 |
HEERMAN, MARCEL;VAN PUYMBROECK, JOZEF;BEYNE, ERIC;VANDEVELDE, BART |
分类号 |
H01L21/60;H01L23/13;H01L23/498;H05K1/11;H05K3/02;H05K3/10;H05K3/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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