发明名称 PRINTED WIRING BOARD
摘要 <p>A printed wiring board is disclosed which comprises an insulating layer (11, (12)), at least one resistor device (311, (312)), and a conductive pattern (351, (352)). The resistor device (311, (312)) mainly contains a metal, and has an arithmetic surface roughness of 0.5-5 mum in one surface (in the -Z direction) and an average thickness of 5-50% of the arithmetic surface roughness. The resistor device (311, (312)) is embedded in one surface (in the -Z direction) of the insulating layer (11) so that the one surface of the resistor device forms a wiring surface for conductive pattern together with the one surface of the insulating layer (11). The conductive pattern (351, (352)) is formed on the wiring surface and connected to a terminal portion of the resistor device (311, (312)). By having such a structure, the printed wiring board can have a built-in resistor device which has stable, high-precision resistance over a wide resistance range.</p>
申请公布号 WO2005002303(A1) 申请公布日期 2005.01.06
申请号 WO2004JP08721 申请日期 2004.06.21
申请人 IBIDEN CO.,LTD.;TSUKADA, KIYOTAKA;IWATA, TOSHIMASA;NINOMARU, TERUMASA;SUGIURA, TAKAMICHI 发明人 TSUKADA, KIYOTAKA;IWATA, TOSHIMASA;NINOMARU, TERUMASA;SUGIURA, TAKAMICHI
分类号 H05K1/16;H05K3/10;H05K3/46;(IPC1-7):H05K1/16 主分类号 H05K1/16
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