Cooling resilient contact device for a semiconductor chip

摘要

A base contact device (BCD) (4) links directly to a semiconductor chip (SC) (1) to make electric contact and to lead heat away. A connection device (CD) (8) links to the BCD electrically and through heat conduction so that the largest part of heat carry-off from the SC occurs via the CD. A conductor device (6) connects electrically between the BCD and the CD as well as through heat conduction. Independent claims are also included for the following: (a) A semiconductor power module with a semiconductor chip and a contact device; (b) and for a method for cooling a semiconductor chip.